Saludos!
Aca les dejo en Ingles las especificaciones de esta maquina que vi en amazon, estoy interesado en comprarla quiero empezar con una maquina sencilla por ahora solo estoy interesado en reballing a Ordenadores poprtatiles, quizas mas adelante XBOX y Ps3 mi curiosidad es: si esta maquina es capaz de hacer todo eso o me quedo corto?
SPECIFICATION:
Power supply:AC220V±10%50/60Hz
Total Power:2600W
Top heater:Hot air 800W
Bottom heater:IR Preheating area 1800w
Positioning:V-groove, PCB support can be adjusted in X,Y direction with external universal fixture
Temperature control:K-sensor closed loop control, independent heating
Temp accuracy:±°C
PCB size:Max 300mm*300mm
Min20mm*20mm
BGA chip:5*5~55*55mm
Minimum chip spacing:0.15mm
Machine dimension (L*W*H): 470*400*450mm
Packing dimension (L*W*H): 48*41*53cm NW/GW 14.5/17KG
A01 Main Features
1.Two independent heaters all can set 8 segments heating, cooling and constant temperature, saved temperature profile is unlimited. IR preheat area can be controlled according to PCB size
2.K sensor close loop control and automatic temperature compensation system. It combines with temperature module, which enables temperature accuracy to ±2°C
3.Moveable heater, easy to operate.
4.Hot air nozzles, 360 degree rotation, easy to install and replace, customized is available.
5.V-groove PCB support for rapid, convenience and accurate positioning that fits for all kinds of PCB board.
6.Powerful cross flow fan, cooling the PCB board efficient after heating, to prevent it from deformation.
7.Sound hint system. There is an alarm before the completion of each desoldering and soldering.
8.CE certification, with emergency switch and automatic power-off protection device when emergency happens.
