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MC-301N
Nitrogen-ready Benchtop/Batch Reflow Oven
Nitrogen-ready, Profilable Batch Reflow Oven w/ Android™ OS
Match your solder paste manufacturers’ precise specifications for preheat, soak, reflow, and cooling with the MC-301N Nitrogen-ready Batch Reflow Oven. By simulating the conditions of an inline reflow system in a benchtop unit, the MC-301N is ideal for product development, prototyping, and manufacturability testing. Detailed solder profiles are easily programmed, stored, and downloaded through the MC-301N’s exclusive hardware control app and Android operating system. Android architecture also allows users to take advantage of touch screen operation and integrated wireless networking for data transfer. Connection for nitrogen input and integrated flow controller included.
Available late December 2013.
MC-301N Benchtop/Batch Reflow Oven
1 Android software platform and ultra-high-resolution touch screen display
2 Simulate profiles of inline ovens with preheat, soak, reflow, and cooling
3 Multi-channel PID zone temperature control for maximum temperature stability
4 Dual control modes - via heater thermocouples or built-in, on-board thermocouple
5 Front-loading heating chamber with working area of 9.84" x 7.87" (250 x 200 mm)
6 Built-in WiFi hardware supports seamless data transfer
7 Connection for nitrogen input and integrated flow controller included
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Compact Benchtop Design Ideal for Labs and Small-Scale Production
Compact Benchtop Design Ideal for Labs and Small-Scale Production
Measuring only 27.2" L x 18.9" W x 11" H (690 mm L x 480 mm W x 280 mm H) and weighing under 90 pounds, the MC-301 easily installs on virtually any benchtop. Its ability to simulate inline reflow profiles with preheat, soak, reflow, and cooling phases makes it a great choice for labs or other installations where space is often at a premium. The front-loading heating chamber has a working area of 9.84" x 7.87" (250 x 200 mm) and includes a window for viewing of the soldering process.
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Easy Installation Will Have You Up and Running in No Time
Easy Installation Will Have You Up and Running in No Time
The MC-301 has an average power rating of 3.6 KW (6.2 KW, peak) and requires a 220-240V, single-phase, voltage supply rated at no less than 15 amps. Built-in circulation fans provide air flow for heating and cooling, and hot air is exhausted through a 3" flanged outlet on the rear of the unit. For removal of a mixture of hot air and flux fumes, it is recommended that the exhaust port be connected with flexible ducting to a system that can accept a flow of approximately .22 CFM (6.3 L/min).
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Exclusive Android-Based Control Application
Exclusive Android-Based Control Application
The MC-301 Android-based control app provides an easy-to-use, touch-panel interface with virtual keyboard for setting the temperature and duration of the preheat, soak, reflow, and cooling stages. In the reflow zone, the user can specify the dwell at both the melting and peak temperatures. Based on these settings, the system will also automatically calculate the heating or cooling rate in each stage for verification with solder paste and component manufacturers' specifications. In addition, when heater control is based on the higher temperature measured at the heaters, the system displays the calculated board temperature based on a calibrated offset.
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Real-Time Temperature Control via On-Board Thermocouple
Real-Time Temperature Control via On-Board Thermocouple
In the MC-301's password-protected advanced settings, the unit can be switched into a separate control mode that uses real-time feedback from a built-in, flying thermocouple. In this mode, with the thermocouple attached at a strategic location on the PCB surface, heater control is based on the actual temperature measured at the thermocouple. As you can see in this screen capture, the target temperature is equal to the thermocouple temperature and there is no offset.
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Temperature Recordings Easily Saved and Distributed via WiFi
Temperature Recordings Easily Saved and Distributed via WiFi
In the run mode, the high-resolution touch-panel displays a graphical representation of the heat zone temperature (red) versus the PCB temperature (yellow) throughout the reflow cycle. For process control and traceability, screens can be saved as separate files and distributed electronically via Email or across networks using the Android OS and built-in WiFi capability.
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